As Qualcomm’s Snapdragon Summit kicks off on September 22, Samsung is marking a mobile memory milestone of its own. The company says it has become ...

Glass substrate adoption by major tech players may be closer than expected. KIPOST reports that NVIDIA has asked substrate ...

China’s semiconductor sector delivered record first-half results in 2026, fueled by a memory upcycle, growing AI computing ...

As interest from external customers in Intel’s EMIB (Embedded Multi-die Interconnect Bridge) continues to grow, substrate ...

The AI packaging boom is reshaping South Korea’s HBM export flows, with Malaysia taking on a growing role. According to Chosun Biz, South Korea’s ...

Alibaba is accelerating its push into AI infrastructure with new in-house chips. According to ijiwei, Alibaba’s T-Head has ...

As TSMC prepares for A16 risk production in late 2026, its next-generation A14 node is reportedly running ahead of schedule.

The rise of personal AI agents could change the computing requirements behind AI workloads. According to Wccftech, personal ...

Intel has recently disclosed a patent originally filed in 2022, revealing an IC packaging architecture that integrates Micro ...

AI demand is showing little sign of slowing over the next couple of years. NVIDIA CEO Jensen Huang, according to CNBC, expects chip sales to double ...

As AI demand drives growth in advanced packaging, TSMC is strengthening equipment and materials validation across its supply ...

Fresh off announcing LPDDR6 mass production and its debut in Xiaomi’s 18 Fold, CXMT has reached another major milestone.