Prof. Tae Geun Kim at Korea University and his co-workers have dismantled a long-standing technological barrier by learning how to sculpt heat within a nanometer-thin sandwich of materials.

Teradyne, Inc., a provider of automated test equipment and advanced robotics, today announced Iris 100, a production-ready optical test platform for microLED devices.

Marvell Technology, Inc. today announced industry-first 2nm optical interconnect demonstrations that advance the next generation of AI data center connectivity.

Magnachip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal power semiconductor platform solutions, today announced that Navitas Semiconductor Corporation has agreed to ...

Global semiconductor revenue surpassed $425bn in 2Q26 reaching another all-time high as the market grew a record 31.4% ...

Samsung Electro-Mechanics will participate in the 'KPCA Show 2026' (International Semiconductor Substrate & Advanced ...

Results of 15th annual Luminaries survey to be presented at live event held during SPIE Photomask Technology + EUV Lithography Conference.

Taiyo Holdings Co., Ltd., based in Tokyo, presented a paper on September 10, 2026, at the 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026), held in Helsinki, Finland, on ...

Nordson Test & Inspection will showcase its comprehensive portfolio of industry-leading optical, X-ray, acoustic inspection, and metrology technologies powered by the Nordson Intelligence Ecosystem at ...

The MV-9SiP Hybrid 3D Inspection System combines 2D vision, 12-projection Digital Blue Light Moiré, and Blue Laser Scanning ...

Traditional measurement approaches like strain gauges and LVDT displacement sensors are reaching their limits for detecting ...