Cadence's new RTL generation agent automates specification-to-code workflows, targeting early power, performance, and area ...
Rising prices and concentrated shipments from DRAM module makers in the second half of the year helped drive the industry's ...
Besxar's first space mission tests vacuum-enabled wafer processing, laying groundwork for autonomous compound semiconductor ...
GUC will offer proteanTecs monitoring across custom SoCs to improve power, performance, reliability and field diagnostics.
Lattice's Mach-N2 combines higher logic density, integrated flash and post-quantum cryptography for secure system control.
Global Unichip Corp.’s (GUC) design-ready HBM4E PHY and Controller IP has been adopted in customer AI ASICs. Implemented on ...
NanoBridge adopts Siemens' Precision FPGA Synthesis to streamline development of non-volatile FPGAs for demanding ...
TI's TMCS2100-Q1 combines multiaxial sensing and proprietary algorithms to improve current measurement accuracy in EV ...
Kioxia advances NAND-based CXL memory to supplement DRAM, targeting higher-capacity, lower-cost memory for AI workloads.
The highly integrated ICs have changed the appearance of the analog-circuit schematic diagrams over the years.
Designers must balance efficiency, voltage range, control complexity and cost when selecting isolated bidirectional ESS ...
SEIPI says improved infrastructure, energy reliability, and connectivity can support higher-value semiconductor manufacturing ...
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