Marvell Technology, Inc. today announced industry-first 2nm optical interconnect demonstrations that advance the next generation of AI data center connectivity.

Prof. Tae Geun Kim at Korea University and his co-workers have dismantled a long-standing technological barrier by learning how to sculpt heat within a nanometer-thin sandwich of materials.

Teradyne, Inc., a provider of automated test equipment and advanced robotics, today announced Iris 100, a production-ready optical test platform for microLED devices.

Magnachip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal power semiconductor platform solutions, today announced that Navitas Semiconductor Corporation has agreed to ...

Micron Technology, Inc. today announced a major milestone in memory innovation with the successful demonstration of the world’s first 512GB DDR5 module on multiple server platforms. The achievement ...

Nordson Test & Inspection will showcase its comprehensive portfolio of industry-leading optical, X-ray, acoustic inspection, and metrology technologies powered by the Nordson Intelligence Ecosystem at ...

Multi-year strategic agreement increases capacity for high-performance SiGe technology to support growing AI infrastructure demand.

Dnotitia Inc. (Dnotitia), an AI data infrastructure and semiconductor company, today announced that the first ASIC samples of its Vector Data Processing Unit (VDPU) have returned from fabrication, ...

Most of the industry's AI conversation focuses on chip design, supply chains, and data center demand, but Shalini Sharma of ...

Multiple Solstice S8 orders key to production ramp for InP photonics manufacturing, supporting next-generation optical interconnects for AI data centers.

TeRAM today emerged from stealth with $37 million in equity financing from early-stage investors to tackle the memory wall facing AI deployment. The company is developing custom 3D SRAM for frontier ...