Semtech joins the XPO MSA with 200G/lane optical ICs aimed at high-density, low-power AI data center interconnects.

IonQ and Synopsys demonstrate a hybrid quantum approach that cuts engineering simulation runtimes by up to 14.6%.

Marvell showcases 2nm optical interconnects and coherent technology for next-generation AI data centers at ECOC 2026.

WISeKey and SEALSQ plan a post-quantum semiconductor and cybersecurity center in Switzerland’s Canton of Jura.

Acer expects PC prices to peak in mid-2027 before falling as memory supply improves and Chinese capacity pressures component ...

ACDSee Photo Studio Ultimate 2027 combines privacy-first AI running locally on PCs with new cloud-based generative image editing tools.

Arteris expands its multi-die chiplet portfolio with FlexGen Multi-Die NoC IP for UCIe-based AI and HPC architectures.

ABB partners with Ferrari Hypersail to test 800 VDC power, renewable energy management and microgrid technology in extreme ocean conditions.

Axiomtek's CAPA332 3.5-inch SBC combines Intel N97 or N150 processors, triple-display support, dual 2.5GbE and three M.2 ...

Aitech launches the C165 rugged VME SBC with Intel Tiger Lake processing and secure storage for defense systems.

ASRock Industrial launches Intel Core Ultra Series 3 platforms for high-performance edge AI, industrial automation and intelligent computing.

Elma's VNX+ deployment kit combines VITA 90 hardware, Raspberry Pi CM5, 40G data links and rugged qualification for mission systems.