Teradyne has introduced Iris 100, a production-ready optical test platform for microLED devices that measures spectral ...

Molex has introduced VersaBeam Mini, a 16-fiber Expanded Beam Optical (EBO) connector with a 3.5 × 9 mm Very Small Form ...

Considered too expensive to deploy at scale in mobile networks, mmWave technologies are appearing in other use cases. When ...

Rambus is shipping a CryptoManager Root of Trust built to work with the open-source Caliptra specification, aimed at data ...

Ironwood Electronics has introduced a 70-GHz elastomer socket designed for 37.5 × 37.5-mm BGA packages with a 0.65-mm pitch.

TDK Corporation has expanded its CN series of low-resistance soft-termination SMD MLCCs with a 100 V X7R component that ...

Elma Electronic has released the VersaPLUS Deployment Kit, an off-the-shelf VNX+ system for integrating, qualifying and deploying embedded computing platforms based on the VITA 90 standard. Weighing ...

Morse Micro’s Wi-Fi HaLow™ USB network adapters use the MM8108 Wi-Fi HaLow chipset and are available in USB-A and USB-C ...

Ambarella has rolled out a cluster of edge AI announcements centered on its new X7 accelerator, alongside expanded developer ...

Lattice Semiconductor has introduced the Lattice Mach™-N2 FPGA family for system control and security in compute, communications and industrial infrastructure. Built on the Lattice Nexus™ 2 platform, ...

Micron Technology, Inc. demonstrated a 512GB DDR5 RDIMM with speeds up to 9,200 MT/s for AI, analytics, in-memory database and simulation workloads. The module uses vertically stacked DRAM dies ...

Level VII efficiency standards don’t appear to be coming any time soon. Designers need to prepare today for that possibility. The previously anticipated strict performance requirements were inspired ...