Semtech joins the XPO MSA with 200G/lane optical ICs aimed at high-density, low-power AI data center interconnects.

IonQ and Synopsys demonstrate a hybrid quantum approach that cuts engineering simulation runtimes by up to 14.6%.

Marvell showcases 2nm optical interconnects and coherent technology for next-generation AI data centers at ECOC 2026.

WISeKey and SEALSQ plan a post-quantum semiconductor and cybersecurity center in Switzerland’s Canton of Jura.

Arteris expands its multi-die chiplet portfolio with FlexGen Multi-Die NoC IP for UCIe-based AI and HPC architectures.

Acer expects PC prices to peak in mid-2027 before falling as memory supply improves and Chinese capacity pressures component ...

ACDSee Photo Studio Ultimate 2027 combines privacy-first AI running locally on PCs with new cloud-based generative image editing tools.

ABB partners with Ferrari Hypersail to test 800 VDC power, renewable energy management and microgrid technology in extreme ocean conditions.

Axiomtek's CAPA332 3.5-inch SBC combines Intel N97 or N150 processors, triple-display support, dual 2.5GbE and three M.2 ...

Aitech launches the C165 rugged VME SBC with Intel Tiger Lake processing and secure storage for defense systems.

Elma's VNX+ deployment kit combines VITA 90 hardware, Raspberry Pi CM5, 40G data links and rugged qualification for mission systems.

ASRock Industrial launches Intel Core Ultra Series 3 platforms for high-performance edge AI, industrial automation and intelligent computing.