Researchers at UCLA published a technical paper titled “Can Agents Design Better Chips with a Higher Level Abstraction?” ...

Researchers at the University of Wisconsin–Madison and Marist University published a technical paper titled “Demystifying ...

Researchers at Georgia Tech, Nvidia Research, and Stanford University published a technical paper titled “BOOST: Concurrent Access to Host Memory and HBM to Accelerate LLM Inference.” Abstract Excerpt ...

Cost per token is causing EDA design budgets to balloon; what comes next isn’t entirely clear yet. Discussions have shifted ...

As AI systems scale, advanced power delivery innovations are becoming critical to performance, efficiency and reliability.

A scalable LPDDR-based memory platform optimized for edge AI inferencing.

Package twins must track what manufacturing actually builds, not just design intent. Missing process and supplier data can undermine otherwise precise simulations. Coupled physics and ongoing ...

Technical Paper Research Organizations; CHIPSMORE: Compute-in-Interconnect and -Memory Chiplets for Multi-Mode Multi-Request LLM Inference Acceleration: National University of Sin ...

Increasingly complex chip designs require more test data than those developed at older nodes and on single planar dies. The ...

Warpage is becoming a bigger constraint as package, interposer, and panel sizes grow. Negative thermal expansion (NTE) materials, newly on the market, can help counter warpage. Commercial NTE ...

Intel may be the marquee name, but materials suppliers, packaging hubs, and quantum startups will determine whether the region becomes a true semiconductor ecosystem.

Semiconductors are no longer viewed as purely commercial products. They are now deeply connected to AI, economic ...