FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in ...
What if there is a biodegradable packaging material with high performance without leaving microplastics? Plastic pollution presents a global challenge that must be solved. In particular, packaging ...
The Interdisciplinary Institute for Technological Innovation (3IT) at Quebec's Université de Sherbrooke has purchased ClassOne Technology's Solstice® LT plating system for advanced packaging R&D ...
Pure nickel is very hard, ductile, shiny, resistant to corrosion, and has a silvery-white color. Thanks to these extraordinary properties, nickel is often utilized in surface engineering and coating ...
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