Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Mentor Graphics is bringing together the IC design, package design and PCB layout in a single tool environment. The design environment called Xpedition Package Integrator flow can be used to integrate ...

This application note focuses on printed circuit board (PCB) layout considerations for QFN and DQFN packages. This is intended for users who are familiar with PCB design, as well as, signal integrity ...

Looking to address a range of PCB design challenges, including growing complexity, Mentor Graphics has announced the first phase of a new systems design enterprise platform. Called Xpedition – and ...

Cadence has upgraded its Allegro and OrCAD pcb packages. The latest releases are said to bring significant new benefits, including the ability to miniaturise end product footprint and a reduction in ...