Smaller PCBs, including rigid-flex circuits, call for die attach using one of three methodologies, depending on the application Technologies that for years were the sole domain of semiconductor ...

Using a chip-first die attach process, this investigation will address die shift and deformation using various release and thermoplastic bonding materials. Combinations using different EMC products ...

QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...

High-power semiconductor applications currently represent one of the highest growth sectors of any semiconductor technology, specifically because many of the key applications are driven by the ...

The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...

SAN JOSE, Calif.--(BUSINESS WIRE)--TDK Corporation (TSE: 6762) will present the latest in load port and flip chip technology at Booth 1926 in the South Hall at the SEMICON West Conference 2019, July 9 ...

SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave ...

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Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

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